• 1989 Initiated Development at Digital Equipment Corp. – Canada
• 1994 Patents Awarded for Method and Coupon Design
• 1995 PWB Interconnect Solutions Incorporated
• 1996 First Systems Installed in North America
• 1998 First Systems Installed in Asia/Europe
• 2000 IPC Approval Received (TM 650, Method Number 2.6.26)
• 2002 Generic Design/Testing/Reporting Strategy Developed
• 2003 68 IST Machines in the Field – Test Services Expanded
• 2004 Increase Capability in Analysis of Material with TMA and DMA
• Present – Focus on Lead Free + Statistical and Prediction Tools
 
The IST test system applies a DC current to PWB test vehicles internal and external interconnect, monitoring and controlling the resistance/temperature throughout each cycle. The PTH interconnect is generally heated to temperatures above the glass transitional (Tg) of the base material (e.g. 150C +/- 3C in 3 minutes)
Differential thermal expansion is created and continues throughout testing until failure inception initiates as micro-structure cracking, located in specific regions within one or both interconnects. Cycling continues until one of the specified rejection criteria is achieved. Coupon rejection can be based on a maximum number of cycles or percentage increases in PTH/Post interconnect elevated resistance.
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Other related Information |
About IST  IST History.pdf
IPC Standard TM2626-Jan2000.PDF
Application Note Sun Microsystems.pdf
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