Generic Design Overview
The Generic IST coupons are designed to enable the customer to use a single design for multiple applications. The intent is to permit flexibility in the construction, related to number of layers, stack-up, copper weights and feature sizes (within the limits of the instructions included within each design file).
Each commonly used technology (Plated through hole, blind via, buried via, micro via, sequential lamination and back plane) is supported. Please follow the links in the Technology flow chart to determine which coupon design is best suited to fit the application.
If the Generic files do not suit your purpose, custom design files are available upon request. In order to identify the most appropriate design it is necessary to complete an IST Design Work Sheet. The required details identify the type of technology (PTH, Blind/Buried Via, Microvia, Sequential lamination, Back Plane, Etc.) to be constructed. Additional information regarding the number of layers and function, basic construction, copper weights, attribute sizes and via grid (pitch) size. Following the submittal of the work sheet, communications will be initiated to confirm whether an existing file or new design will suit the design intent.
Below is the data sheet for coupon design file.
If you want get the document file, please feel free to caontact with me for futher info. Thanks a lot!
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